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Technical Specifications

Electroplating chemistries engineered to mil-spec tolerances

Micron-accurate deposit thicknesses verified through disciplined bath chemistry, continuous titration, and X-ray fluorescence testing across all active production lines.

Bath Parameters

Core electroplating envelopes

Rigorous rack and barrel processing designed for extreme wear resistance, corrosion prevention, and exact dimensional tolerances.

Gold & Nickel Plating

Copper & Tin Substrates

Substrate Passivation

Electroless and electrolytic nickel conforming to AMS-2404 alongside high-purity gold deposits for electrical conductivity.

Acid copper and matte tin plating optimized for thermal dissipation and prevention of whisker formation on complex alloys.

Precision chemical treatments removing free iron from stainless steel and titanium components for optimal corrosion resistance.

Workflow

Controlled deposition sequence

01
02
03
04

Pre-treatment Degreasing

Ultrasonic Cleaning

Electro-Deposition

Post-Bake Degassing

Aqueous alkaline cleaning removes organic residues and machining oils prior to surface activation.

High-frequency cavitation clears micro-blind holes and complex internal geometries on machined substrates.

Controlled current density and continuous bath titration deposit precise micrometric plating layers.

Thermal treatment relieves hydrogen embrittlement on high-strength aerospace alloys per mil-spec standards.

Quality Assurance

Verification protocols

XRF

fluorescence testing

100%

adhesion tape verification

ASTM

salt spray compliance

Request Spec Sheet

Submit your substrate specifications and batch quantities

Direct engineering appraisal for custom masking schedules and specialized alloy treatments.